DNS Records
A | 35.199.177.33 |
CNAME | ieeepress.wpengine.com |
JSON+LD
{
"@context": "https://schema.org",
"@graph": [
{
"@type": "WebPage",
"@id": "https://ieee-press.ieee.org/",
"url": "https://ieee-press.ieee.org/",
"name": "IEEE Press - Home",
"isPartOf": {
"@id": "https://ieee-press.ieee.org/#website"
},
"about": {
"@id": "https://ieee-press.ieee.org/#organization"
},
"primaryImageOfPage": {
"@id": "https://ieee-press.ieee.org/#primaryimage"
},
"image": {
"@id": "https://ieee-press.ieee.org/#primaryimage"
},
"thumbnailUrl": "https://ieee-press.ieee.org/wp-content/uploads/2023/10/039-open-book.png",
"datePublished": "2023-10-04T13:02:10+00:00",
"dateModified": "2024-07-30T14:08:17+00:00",
"description": "IEEE Press publishes high-quality books and reference works in electrical engineering and computer science in partnership with Wiley.",
"breadcrumb": {
"@id": "https://ieee-press.ieee.org/#breadcrumb"
},
"inLanguage": "en-US",
"potentialAction": [
{
"@type": "ReadAction",
"target": [
"https://ieee-press.ieee.org/"
]
}
]
},
{
"@type": "ImageObject",
"inLanguage": "en-US",
"@id": "https://ieee-press.ieee.org/#primaryimage",
"url": "https://ieee-press.ieee.org/wp-content/uploads/2023/10/039-open-book.png",
"contentUrl": "https://ieee-press.ieee.org/wp-content/uploads/2023/10/039-open-book.png",
"width": 74,
"height": 69,
"caption": "039 open book"
},
{
"@type": "BreadcrumbList",
"@id": "https://ieee-press.ieee.org/#breadcrumb",
"itemListElement": [
{
"@type": "ListItem",
"position": 1,
"name": "Home"
}
]
},
{
"@type": "WebSite",
"@id": "https://ieee-press.ieee.org/#website",
"url": "https://ieee-press.ieee.org/",
"name": "IEEE Press",
"description": "Publisher of Engineering Books",
"publisher": {
"@id": "https://ieee-press.ieee.org/#organization"
},
"potentialAction": [
{
"@type": "SearchAction",
"target": {
"@type": "EntryPoint",
"urlTemplate": "https://ieee-press.ieee.org/?s={search_term_string}"
},
"query-input": {
"@type": "PropertyValueSpecification",
"valueRequired": true,
"valueName": "search_term_string"
}
}
],
"inLanguage": "en-US"
},
{
"@type": "Organization",
"@id": "https://ieee-press.ieee.org/#organization",
"name": "IEEE Press",
"url": "https://ieee-press.ieee.org/",
"logo": {
"@type": "ImageObject",
"inLanguage": "en-US",
"@id": "https://ieee-press.ieee.org/#/schema/logo/image/",
"url": "https://ieee-press.ieee.org/wp-content/uploads/2023/08/Press-logo-black.png",
"contentUrl": "https://ieee-press.ieee.org/wp-content/uploads/2023/08/Press-logo-black.png",
"width": 600,
"height": 116,
"caption": "IEEE Press"
},
"image": {
"@id": "https://ieee-press.ieee.org/#/schema/logo/image/"
}
}
]
}